JPH0468542U - - Google Patents
Info
- Publication number
- JPH0468542U JPH0468542U JP11257390U JP11257390U JPH0468542U JP H0468542 U JPH0468542 U JP H0468542U JP 11257390 U JP11257390 U JP 11257390U JP 11257390 U JP11257390 U JP 11257390U JP H0468542 U JPH0468542 U JP H0468542U
- Authority
- JP
- Japan
- Prior art keywords
- strain stress
- semiconductor wafer
- ultrasonic waves
- applies
- braking device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11257390U JPH0468542U (en]) | 1990-10-25 | 1990-10-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11257390U JPH0468542U (en]) | 1990-10-25 | 1990-10-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0468542U true JPH0468542U (en]) | 1992-06-17 |
Family
ID=31860081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11257390U Pending JPH0468542U (en]) | 1990-10-25 | 1990-10-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0468542U (en]) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007141999A (ja) * | 2005-11-16 | 2007-06-07 | Denso Corp | 半導体基板の分断装置および半導体基板の分断方法 |
| JP2020038871A (ja) * | 2018-09-03 | 2020-03-12 | 株式会社ディスコ | 被加工物の加工方法 |
-
1990
- 1990-10-25 JP JP11257390U patent/JPH0468542U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007141999A (ja) * | 2005-11-16 | 2007-06-07 | Denso Corp | 半導体基板の分断装置および半導体基板の分断方法 |
| JP2020038871A (ja) * | 2018-09-03 | 2020-03-12 | 株式会社ディスコ | 被加工物の加工方法 |